| Software | ||
Triex has multiplexers and also developed software for ultrasonic signals acquisition and analysis. The software we wrote is made to manipulate hundreds of thousands of readings, usually necessary to evaluate the condition of ship hulls. The software is written in Labview and controls scope boards made by National Instruments to carry the data acquisition. The software can work with 8, 12, 14 or 16 bit acquisition boards. It is also possible to use any model of ultrasonic multiplexer and even more than one multiplexer in the system. According to the user needs, the system can use any flaw detector, made by any manufacturer, as long as an RF output with the UT pulse eco signal is available in the instrument. Depending on the hardware combination (8 channel scope board and 8, 32 channel multiplexer), it is possible to sweep 256 transducers in one second.
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Ultrasonic Multiplexers | |
| 1. Ultrasonic Multiplexers 2. Mux Configurations 3. Applications ( Part I) 4. Applications ( Part II ) 5. Software 6. Technical Specifications & Mux Models |
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The software written by Triex evaluates the A-Scan signal (pulse eco) and calculates the thickness. It is possible to use water as couplant and the system can be programmed to consider only the travel time in the metal, not in the water. The system can accept direct contact transducer configuration or not. |
The system requires a very fast computer and a high capacity hard disk if the user wants to store the A-Scan signal of each point measured. A typical A-Scan signal requires an 8 Kbyte storage space. The measurement of one square meter, with 1 cm resolution, generates 100 x 100 = 10000 readings. These readings require 80 Mbytes storage space. The software provides many ways to see the readings and signals. It is possible, for example, to see 64 A-Scan signals in just one screen. |
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When Triex software is used to inspect ship hulls and oil rigs, there is an extra serial port available to receive positioning information from systems like Pharos, made by Sonardyne. Besides thickness and A-Scan, the software can show B-Scan and C-Scan graphics. There are also modules for statistical and trend analysis, very useful to anticipate preventive maintenance. |
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Triex can sell multiplexers, software and if necessary the whole system, including computers, acquisition scope boards and cabling. We can write software drivers for virtually any flaw detector, as long as the instrument has a RF output with the pulse eco signal available.
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A C-Scan diagram is one of the most eficient ways to evaluate the thickness condition of metal boards. Sonix, the software developed by Triex for ultrasonic acquisition and analysis, has C-Scan diagrams but also an additional way to present thickness information we decided to call D-Scan, as a reference to 3D. A D-Scan diagram presents a tridimensional picture of a metal board. It is only possible and reliable when a high resolution acquisition is done. This is where Triex ultrasonic multiplexers play a very important role. The next picture shows a C-Scan diagram of a metal board 5 by 5 meters. The low thickness points are found in a regular distribution. |
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We present next a D-Scan diagram of the same metal board, where it is easy to notice the existence and dimension of many low thickness points. The software has many functions to improve the appearence of the D-Scan diagram, making it possible to turn the picture and change some of its parameters to let the operator identify problems faster. |
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A very interesting feature of the D-Scan module is shown in the last picture, where we can see a negative D-Scan. In this presentations the low thickness points are peaks ans the normal points are valleys. This is one among many features available in Sonix, Triex software for UT acquisition and analysis. Is is good to remember that Sonix also works with optical incremental encoders to precisely monitor the position of UT transducers. |
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1. Ultrasonic Multiplexers & Ultrasonic Inspection | 3. Applications ( Part I ) | 5. Software |
| 2. Mux Configurations | 4. Applications ( Part II ) | 6. Technical Specifications & Mux Models |